Introduction to the principle of thermal conduction of thermal conductive gel

With the advancement and development of science and technology, the contemporary electronic information industry is developing rapidly, and people's requirements for the power of electronic equipment are constantly increasing. Rapid and effective heat dissipation and upgrade of electronic and electrical cooling systems have become the key to modern production of miniaturized electronic products. Thermal conductive gel is an effective heat dissipation material, mainly composed of resin matrix [EP (epoxy resin), silicone and PU (polyurethane) and thermally conductive fillers.

The internal heat-conducting carrier of the solid is mainly electrons. There are a large number of free electrons in the metal. The heat can be transferred through the collision between the electrons. The inorganic non-metallic crystal conducts heat through the thermal vibration of the neatly arranged grains. However, its thermal conductivity is much lower than that of crystals, and most polymers are saturated systems without free electrons, so their thermal conduction is mainly achieved through lattice vibration.

Adding high thermal conductivity fillers to the adhesive is the main method to improve its thermal conductivity. The thermally conductive fillers are dispersed in the resin matrix and contact with each other to finally form a thermally conductive network, so that heat can be quickly transferred along the "thermally conductive network", so as to achieve The purpose of improving the thermal conductivity of adhesives.