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Silicone thermal pad can solve the heat dissipation problem of the heat dissipation module
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Silicone thermal pad can solve the heat dissipation problem of the heat dissipation module

Views: 26     Author: Site Editor     Publish Time: 2021-08-16      Origin: Site

One of the common heat dissipation methods in most compact electronic products in the market is to use a heat dissipation module for heat dissipation. So what is a cooling module? Simply put, it is a heat dissipation channel formed by a combination of a radiator and a thermally conductive material, sometimes including a heat dissipation fan. Most of the heat dissipation modules use silicone thermal pads and other similar products to assist in heat dissipation, so that a better heat dissipation effect can be achieved.


The selection of the silicone thermal pad in the heat dissipation module needs to be determined according to the specific situation. For example, the thermal conductivity of the silicone thermal pad needs to be determined according to the temperature difference and heat dissipation effect, and then the thickness of the silicone thermal pad should be selected according to the actual product gap. Thermal conductivity and thickness selection of silicone thermal pad.

Silicone thermal pad

Selection of thickness and thermal conductivity of silicone thermal pad:


1. There are many thermal conductivity coefficients of silicone thermal pad, generally from 1.5W to 13W, as long as it can meet the cooling requirements of the product, the thermal conductivity does not need to be too high, and the thermal conductivity of general electronic products is no problem, and the price is It is not very expensive, and the thermal conductivity is also very good.


2. For the thickness of silicone thermal pad, customers usually choose the corresponding thickness according to the actual gap size of the product. This is correct. For example, if the gap of the product is 1.5mm, most customers directly choose the 1.5mm silicone thermal pad, but the actual application effect is not very satisfactory. Then we need to change the product thickness slightly, and the heat conduction effect will be significantly improved.


If the product gap is 1.5mm, 2.0mm silicone thermal pad should be used, because the silicone thermal pad itself is very soft and has good compressibility, so the compression ratio needs to be considered when choosing the thickness of the silicone thermal pad.


Choosing silicone thermal pad is not the higher the thermal conductivity, the better, but the choice of the appropriate thermal conductivity material according to the actual product situation.


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