The thermal pad manufacturer tells you how much the thickness of the thermal pad is appropriate

Thermal pad manufacturer often encounters different problems in the process of designing thermal and heat dissipation solutions. Such as the thermal conductivity of the thermally conductive material, the hardness of the thermally conductive material, the density and viscosity of the thermally conductive material, and so on. However, there are still many customers who ask the manufacturer how to choose the thickness of the material? Today the thermal pad manufacturer will discuss this issue with you.

The thickness of the thermally conductive silicone sheet is generally selected according to the actual product size of the customer, and is selected according to the gap between the chip, memory bar, cpu and other heating components and the radiator, the water cooling plate and the shell.

If it is said that choosing a suitable thermal conductive material is important to fill the gap of the product, then the thickness of the material is a problem that has to be said, this is an unavoidable problem. The thermal pad manufacturer’s suggestion is to make the material thickness thicker than the product gap. Generally speaking, it needs to be considered and evaluated based on the material’s 20-30% compression margin.

In the same way, if you choose thermal paste or thermal paste, then the material thickness should be evaluated and selected based on the dispensing thickness. Therefore, the customer needs to consider the product gap comprehensively in the choice of material thickness. The material thickness does not have a specific value, so it still depends on the customer's actual product gap to determine.