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GTP-040 Series Thermal Conductive Silicone Pad are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features and Benefits：
.Good Thermal Conductivity
.Electrically Isolating
.Natural tacky
.Easy to assembly
.Cost effective
Applications：
.Computer services: CPU, Heat sink, Memory modules
.LED Lighting, LCD-TV
.Military Electronics
.Power Supplies
.Telecom services, Wireless instruments
.Automotive control services
Property | GTP-040 | Unit | Tolerance | Test Method |
Composition | Filled silicone elastomer | — | ||
Color | Grey | — | — | Visual |
Thermal conductive | 4.0 | W.m-1.K-1 | — | ASTM D5470 |
Thickness | 20-200(1mil=0.0254mm) | mil | ±10% | ASTM D374 |
0.5-5.0 | mm | ASTM D374 | ||
Hardness | 50 | Shore 00 | — | ASTM D2240 |
Density | 3.1 | g.cm-3 | — | — |
Temperature Range | -40～+200 | ℃ | — | — |
Breakdown Voltage | >3000(0.3mm~0.5mm) | V | — | ASTM D149 |
>5000(>0.5mm) | ||||
Flame Rating | UL 94 V-0 | — | — | UL 94 (UL FileE348291) |
Dielectric Constant | 12.6 | MHz | — | ASTM D150 |
Standard Sheet Size | 300*400 | mm | — | — |
Volume Resistivity | 1013 | ohm-cm | — | ASTM D257 |
Tensile Strength | 32 | psi | — | ASTM D412 |
Please contact us for other special requirements such as ：
With or without adhesive
Custom die-cut shapes
Special requirements: hardness, color, thickness, sizes, different structure composition
Sample request
The information and statements herein are believed to be reliable but are not to be construed as a warranty or representation for which we assume legal responsibility. Users should undertake sufficient verification and testing to determine the suitability for their own particular purpose of any information or products referred to herein.
