Low Density Thermal Conductive Gap Filler

GTP-020LD Series Thermal conductive gap filler are applied to fill the air

gaps between the heating elements and the heat dissipation fins or the metal base. Their

flexibility and elasticity make them suited to the coating of the very uneven surfaces.

Heat can transmit to the metal housing or dissipation plate from the separate elements or

even the entire PCB, which in effect enhances the efficiency and life-time of the

heat-generating electronic components.

Features and Benefits：

.Thermal conductivity 2.0W/m-K

. Low Density

. Very soft & high compressibility

.Natural tacky

. Good Electrically isolating

. Excellent resiliency, tensile strength,

and abrasion resistance 

Applications：

. Computer services: CPU, Heat sink,

  Memory modules

.New energy automobile

. Military Electronics

. Telecom services, Wireless instruments

.Telecom services,

. Wireless instruments

. Automotive control services 

 The information and statements herein are believed to be reliable but are not to be construed as a warranty or representation for which we assume legal responsibility. Users should undertake sufficient verification and testing to determine the suitability for their own particular purpose of any information or products referred to herein.

Availability：

. 0.006 inch to 0.4 inch(0.15mm to 10.0mm)

.Stand sheet size is 12＂x 16＂

.FG designates Fiberglass

. DC1 designates proprietary option eliminating tack form one side

.A is meet add addition PSA A1=one side PSA, A2=two side PSA

Examples：

. GTP-020LD(80Shore00) =special hardness 80Shore00

. GTP-020LD-100 =0.1 inch thick material

. GTP-020LDFG-010=0.01 inch material with Fiberglass

.GTP-020LDDC1-100=0.1 inch thickness material with one side none-tacky option

.GTP-020LDA1(3M467)-100=0.1 inch thickness material with 3M467 one side