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Silicone Thermal Pad For PCB,CPU,GPU
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Silicone Thermal Pad For PCB,CPU,GPU

Silicone Thermal Pad, AMG is a superior thermal pad manufacturer production in China | AMG
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Product Description

GTP-030 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.  The Silicone Thermal Pad  flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Silicone Thermal Pad

Features and Benefits:

.Thermal conductivity 3.0 W/m-K 

.Natural tacky

.Very soft & high compressibility

.Good Electrically isolating

.Easy to assembly

.Cost effective


Applications:

 Computer services: CPU, Heat sink, Memory modules 

 LED Lighting, LCD-TV

 Military Electronics

 Power Supplies

 Telecom services, Wireless instruments

 Automotive control services

Property

GTP-030

Unit

Tolerance

Test Method

Composition  

Filled silicone elastomer

Color  

Light Blue

Visual

Thermal conductive 

3.0

W.m-1.K-1

ASTM D5470

Thickness 

12-400(1mil=0.0254mm)

mil

±10%

ASTM D374

0.3-10

mm 

ASTM D374

Hardness  

30-60

Shore 00

ASTM D2240

Density 

2.98

g.cm-3

Temperature Range  

-40~+200

Breakdown Voltage  

>3000(0.3mm~0.5mm)

V

ASTM D149

>5000(>0.5mm)

Flame Rating  

UL 94 V-0

UL 94

(UL FileE348291)

Dielectric Constant  

12.6

MHz

ASTM D150

Standard Sheet Size  

300*400

mm

Volume Resistivity  

1013

ohm-cm

ASTM D257

Tensile Strength  

32

psi

ASTM D412

Please contact us for other special requirements  such as :

.With or without adhesive

.Custom die-cut shapes

.Special requirements: hardness, color, thickness, sizes, different structure composition

.Sample request
















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