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GPU CPU Heatsink Cooling Thermal Conductive Silicone Pad
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GPU CPU Heatsink Cooling Thermal Conductive Silicone Pad

Thermal Conductive Silicone Pad, find complete details about Thermal Conductive Silicone Pad - AMG
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Product Description

GPU CPU Heatsink Cooling Thermal Conductive Silicone Pad GTP-020 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


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Features and Benefits:

.Thermal conductivity 2.0 W/m-K 

. Natural tacky

. Very soft & high compressibility 

. Good Electrically isolating 

. Easy to assembly

. Cost effective


Applications:

.Computer services: CPU, Heat sink, Memory modules 

 LED Lighting, LCD-TV

 Military Electronics

 Power Supplies

 Telecom services, Wireless instruments

 Automotive control services

Property

GTP-020

Unit

Tolerance

Test Method

Composition  

Filled silicone elastomer

Color 

Blue

Visual

Thermal conductive 

2.0

W.m-1.K-1

ASTM D5470

Thickness 

12-400(1mil=0.0254mm)

mil

±10%

ASTM D374

0.3-10

mm 

ASTM D374

Hardness  

30-60

Shore 00

ASTM D2240

Density  

2.3

g.cm-3

Temperature Range  

-40~+200

Breakdown Voltage  

>3000(0.3mm~0.5mm)

V

ASTM D149

>5000(>0.5mm)

Flame Rating  

UL 94 V-0

UL 94

(UL FileE348291)

Dielectric Constant  

4.9

MHz

ASTM D150

Standard Sheet Size  

300*400

mm

Volume Resistivity  

1013

ohm-cm

ASTM D257

Tensile Strength  

28

psi

ASTM D412

Please contact us for other special requirements  such as :

With or without adhesive

Custom die-cut shapes

Special requirements: hardness, color, thickness, sizes, different structure composition 


Sample request



OTHERS

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  amg_zhang@amg-elect.com

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